NJM431S/NJM432S

- 3 -

Ver.2015-06-26

■ TEST CIRCUIT

1

R

I

2

R

1

R

1

V

V

V

REF

REF

KA

O















 





■ POWER DISSIPATION vs. AMBIENT TEMPERATURE

0

200

400

600

800

1000

1200

1400

1600

-50

-25

0

25

50

75

100

125

150

Ambient Temperature : Ta [ºC]

NJM431SU / NJM432SU (SOT-89-3)

Power Dissipation

(Topr=-40ºC to +125ºC, Tj=150ºC)

(*3) on 4 Layers Board

(*2) on 2 Layers Board

0

100

200

300

400

500

600

700

800

-50

-25

0

25

50

75

100

125

150

Ambient Temperature : Ta [ºC]

NJM431SF / NJM432SF (SOT-23-5)

Power Dissipation

(Topr=-40ºC to +125ºC, Tj=150ºC)

(*5) on 4 Layers Board

(*4) on 2 Layers Board

(*2) Mounted on glass epoxy board. (76.2

(*3) Mounted on glass epoxy board. (76.2

 114.3  1.6mm: EIA/JDEC standard size, 4Layers)

(4Layers inner foil: 74.2

 74.2mm applying a thermal via hole to a board based on JEDEC standard JESD51-5)

(*4) Mounted on glass epoxy board based on EIA/JEDEC. (76.2

 114.3  1.6mm: 2Layers FR-4)

(*5) Mounted on glass epoxy board based on EIA/JEDEC. (76.2

 114.3  1.6mm: 4Layers FR-4),

internal Cu area: 74.2

 74.2mm

INPUT

INPUT

R1

R2

INPUT