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© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Product data sheet

Rev. 01 — 29 June 2004

18 of 22

Philips Semiconductors

74LVC2G66

Bilateral switch

15. Package outline

Fig 23. Package outline TSSOP8.

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.00

0.95

0.75

0.38

0.22

0.18

0.08

3.1

2.9

3.1

2.9

0.65

4.1

3.9

0.70

0.35

8

°

0

°

0.13

0.1

0.2

0.5

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.47

0.33

SOT505-2

- - -

02-01-16

bp

D

Z

e

0.25

14

8

5

θ

A2

A1

Lp

(A3)

detail X

A

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm

SOT505-2

1.1

pin 1 index