Data Sheet S15535EJ2V0DS

30

4.

RECOMMENDED SOLDERING CONDITIONS

The

µPD720100A should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

µµµµPD720100AGM-8ED: 160-pin plastic LQFP (Fine pitch) (24 ×××× 24)

µµµµPD720100AGM-8EY: 160-pin plastic LQFP (Fine pitch) (24 ×××× 24)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Exposure limit: 3 days

IR35-103-3

Partial heating

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

µµµµPD720100AS1-2C: 176-pin plastic FBGA (15 ×××× 15)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Exposure limit: 7 days

IR35-107-3

Partial heating

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.