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LM317S/NOPB 데이터시트(PDF) 30 Page - Texas Instruments

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부품명 LM317S/NOPB
상세설명  Wide Temperature Three-Pin Adjustable Regulator
PDF  48 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

LM317S/NOPB 데이터시트(HTML) 30 Page - Texas Instruments

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LM117, LM317-N
SNVS774P – MAY 2004 – REVISED OCTOBER 2015
www.ti.com
Thermal Considerations (continued)
Figure 40. Maximum Power Dissipation vs TAMB for the
Figure 39.
θJA vs Copper (2-oz.) Area for the SOT-223
SOT-223 Package
Package
11.3.2.2 Heatsinking the TO-263 (KTT) Package
Figure 41 shows for the TO-263 the measured values of
θJA for different copper area sizes using a typical PCB
with 1-oz. copper and no solder mask over the copper area used for heatsinking.
As shown in Figure 41, increasing the copper area beyond 1 square inch produces very little improvement. It
must also be observed that the minimum value of
θJA for the TO-263 package mounted to a PCB is 32°C/W.
Figure 41.
θJA vs Copper (1-oz.) Area for the TO-263 Package
As a design aid, Figure 42 shows the maximum allowable power dissipation compared to ambient temperature
for the TO-263 device (assuming
θJA is 35°C/W and the maximum junction temperature is 125°C).
30
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Product Folder Links: LM117 LM317-N



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