LM117, LM317-N

www.ti.com

SNVS774P – MAY 2004 – REVISED OCTOBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Power dissipation

Internally Limited

Input-output voltage differential

−0.3

40

V

Metal package (soldering, 10 seconds)

300

°C

Lead temperature

Plastic package (soldering, 4 seconds)

260

°C

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

±3000

V

discharge

(1)

Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher

performance.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating temperature (LM117)

−55

150

°C

Operating temperature (LM317-N)

0

125

°C

7.4 Thermal Information, LM117

LM117

NDS

NDT

UNIT

(TO-3)

(TO)

2 PINS

3 PINS

39

186

°C/W

Junction-to-case (top) thermal resistance

2

21

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

No heatsink.

Copyright © 2004–2015, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: LM117 LM317-N