TFP501

SLDS127C

– JULY 2001 – REVISED JULY 2011

www.ti.com

Table 1. TI 100-TQFP (14

× 14 × 1 mm)/0.5 mm Lead Pitch

WITHOUT

PowerPAD

™

PowerPAD

™

PARAMETER

PowerPAD

NOT CONNECTED TO PCB

CONNECTED TO PCB

™

THERMAL PLANE

49.17

°C/W

27.32

°C/W

17.28

°C/W

3.11

°C/W

0.12

°C/W

0.12

°C/W

1.6 W

2.9 W

4.6 W

(1)

Specified with the PowerPAD bond pad on the backside of the package soldered to a 2 oz Cu plate PCB thermal plane.

(2)

Airflow is at 0 LFM (no airflow)

(3)

Specified at 150

°C junction temperature and 70°C ambient temperature.

20

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© 2001–2011, Texas Instruments Incorporated