0

100

200

300

400

500

600

AIRFLOW (Linear Feet Per Minute)

45

46

47

48

49

50

51

0

200

400

600

800

1000

AIRFLOW (Linear Feet per Minute)

SOP Board

JEDEC Board

150

160

140

170

180

100

110

120

130

80

90

LP2996A

SNOSCY7 – JUNE 2014

www.ti.com

Application Information (continued)

Figure 17.

Additional improvements can be made by the judicious use of vias to connect the part and dissipate heat to an

internal ground plane. Using larger traces and more copper on the top side of the board can also help. With

careful layout it is possible to reduce the

Layout is also extremely critical to maximize the output current with the SO PowerPAD package. By simply

placing vias under the DAP the

Additional improvements in lowering the

Maintaining the same conditions as above and utilizing the 2x2 via array, Figure 18 shows how the

with airflow.

Figure 18.

Optimizing the

allows the part to operate with higher power dissipation. The internal power dissipation can be calculated by

at AVIN and VDDQ. During the active state (when shutdown is not held low) the total internal power dissipation

can be calculated from the following equations:

where

(3)

(4)

(5)

simultaneously.

(6)

12

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