LP3936SLSLASHNOPB datasheet(4/30 Pages) TI1

4 / 30 page

LP3936

SNVS259D – NOVEMBER 2003 – REVISED MAY 2013

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Operating Ratings

(1)(2) (continued)

Ambient Temperature (TA) Range

(3)

−40°C to +85°C

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation:

TA-MAX = TJ-MAX-OP − (θJA x PD-MAX).

Thermal Characteristics

Junction-to-Ambient Thermal Resistance (

θJA),

NPC0032A Package (1)

72°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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