LP3971

SNVS432V – JANUARY 2006 – REVISED MAY 2013

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Absolute Maximum Ratings

(1) (2)

All Inputs

−0.3V to +6.5V

GND to GND SLUG

±0.3V

150°C

Storage Temperature

−65°C to +150°C

Power Dissipation

(3)

3.2W

Junction-to-Ambient Thermal

Resistance

(3)

25°C/W

Maximum Lead Temp (Soldering)

260°C

Human Body Model

2 kV

Machine Model

200V

(1)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(2)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-

OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance

of the part/package in the application (

(4)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. (MIL-STD-883 3015.7) The machine

model is a 200 pF capacitor discharged directly into each pin. (EAIJ)

Operating Ratings

2.7V to 5.5V

−40°C to +125°C

−40°C to +85°C

Maximum Power Dissipation

(1) (2)

2.2W

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-

OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance

of the part/package in the application (

(2)

Junction-to-ambient thermal resistance (

forth in the JEDEC standard JESD51–7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array

of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/1.8 µm/18 µm/36 µm (1.5 oz/1

oz/1 oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. Junction-to-ambient thermal resistance is

highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid

to thermal dissipation issues in board design. The value of

paid to thermal dissipation issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe

Package (LLP) and the Power Efficiency and Power Dissipation section of this datasheet.

General Electrical Characteristics

(1)

entire junction temperature range for operation,

−40°C to +125°C.

(2) (3)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Battery Voltage

2.7

3.6

5.5

V

and 3

Power Supply for LDO 4 and 5

1.74

3.6

5.5

V

(1)

No input supply should be higher then VDDA

(2)

All voltages are with respect to the potential at the GND pin.

(3)

All limits specified at room temperature and at temperature extremes. All room temperature limits are production tested, specified

through statistical analysis or by design. All limits at temperature extremes are specified via correlation using standard Statistical Quality

Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

6

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