LPV7215MFSLASHNOPB datasheet(2/28 Pages) TI1

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LPV7215

SNOSAI6I – SEPTEMBER 2005 – REVISED APRIL 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1) (2)

ESD Tolerance (3)

Human Body Model

2000V

Machine Model

200V

VIN Differential

±2.5V

Supply Voltage (V+ - V−)

Voltage at Input/Output pins

V+ +0.3V, V−

−0.3V

Storage Temperature Range

−65°C to +150°C

Junction Temperature (4)

+150°C

Soldering Information

Infrared or Convection (20 sec)

235°C

Wave Soldering Lead Temp. (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

OPERATING RATINGS

(1)

Temperature Range (2)

−40°C to 125°C

Supply Voltage (V+ – V−)

1.8V to 5.5V

Package Thermal Resistance (

θJA

(2))

5-Pin SC70

456°C/W

5-Pin SOT-23

234°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

1.8V ELECTRICAL CHARACTERISTICS

(1)

Unless otherwise specified, all limits are specified for TA = 25°C, V

+ = 1.8V, V− = 0V, and V

CM = V

+/2, V

O= V

−. Boldface limits

apply at the temperature extremes.

Symbol

Parameter

Conditions

Min (2)

Typ (3)

Max (2)

Units

Supply Current

VCM = 0.3V

580

750

1050

VCM = 1.5V

790

980

1300

VOS

Input Offset Voltage

VCM = 0V

±0.3

±6

±8

VCM = 1.8V

±0.4

±5

±7

TCVOS

Input Offset Average Drift

See (4)

±1

μV/C

Input Bias Current (5)

VCM = 1.6V

−40

IOS

Input Offset Current

(1)

Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device.

(2)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using

statistical quality control (SQC) method.

(3)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped

production material.

(4)

Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.

(5)

Positive current corresponds to current flowing into the device.

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