2004 July 12

23

Philips Semiconductors

Product specification

IC card interface

TDA8024

handbook, full pagewidth

100 nF

(3)

(6)

(7)

AUX2UC

AUX1UC

I/OUC

XTAL2

XTAL1

OFF

GND

VDD

RSTIN

CMDVCC

PORADJ

VCC

RST

CLK

CLKDIV1

CLKDIV2

5V/3V

PGND

VDDP

S1

S2

VUP

PRES

PRES

I/O

AUX2

AUX1

CGND

28

27

26

25

24

23

22

21

20

19

18

17

16

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

TDA8024

C5

C6

C7

C8

C1

C2

C3

C4

CARD READ

(normally closed type)

K1

K2

+3.3 V

+3.3 V

VDD

58.1 k

Ω

41.9 k

Ω

3.3 V POWERED

MICROCONTROLLER

33 pF

100 nF

+5 V

10

µF

100 k

Ω

MDB050

Fig.13 Application diagram.

(1) These capacitors must be of the low ESR-type and be placed near the IC (within 100 mm).

(3) Make short, straight connections between CGND, C5 and the ground connection to the capacitor.

(5) Mount one low ESR-type 100 or 220 nF capacitor close to C1 contact (less than 100 mm from it).

(6) The connection to C3 should be routed as far from C2, C7, C4 and C8 and, if possible, surrounded by grounded tracks.

Pin 18 is not connected in the TDA8024AT.