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CC2650MODA

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SWRS187A – AUGUST 2016 – REVISED AUGUST 2016

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Application, Implementation, and Layout

Copyright © 2016, Texas Instruments Incorporated

7.2

Layout

7.2.1

Layout Guidelines

Use the following guidelines to lay out the CC2650MODA device:

•

The module must be placed close to the edge of the PCB.

•

TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in

Figure 7-2 and Figure 7-3.

•

TI recommends using a generous amount of ground vias to stitch together the ground planes on

different layers. Several ground vias should be placed close to the exposed ground pads of the

module.

•

No external decoupling is required.

•

The reset line should have an external pullup resistor unless the line is actively driven. Placement of

this component is not critical.

•

TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.

Figure 7-2. Top Layer

Figure 7-3. Bottom Layer