www.ti.com

EXAMPLE STENCIL DESIGN

(0.4) TYP

(0.4) TYP

9X (

0.25)

(R0.05) TYP

METAL

TYP

DSBGA - 0.625 mm max height

YFF0009

DIE SIZE BALL GRID ARRAY

4219552/A 05/2016

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

SYMM

SYMM

C

1

2

3

A

B

BASED ON 0.1 mm THICK STENCIL

SOLDER PASTE EXAMPLE

SCALE:30X

32

TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592

SLVSAG8G – SEPTEMBER 2011 – REVISED JUNE 2016

www.ti.com

Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592

Submit Documentation Feedback

Copyright © 2011–2016, Texas Instruments Incorporated