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USB84604 데이터시트(PDF) 54 Page - Microchip Technology |
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USB84604 데이터시트(HTML) 54 Page - Microchip Technology |
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54 / 61 page ![]() USB84604 DS60001295C-page 54 2014-2016 Microchip Technology Inc. FIGURE 10-1: USB84604 48-PIN QFN PACKAGE DRAWING RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 5.20 5.20 MILLIMETERS 0.50 BSC MIN E MAX 6.90 Contact Pad Length (X48) Contact Pad Width (X48) Y1 X1 0.85 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2363A NOM SILK SCREEN 1 2 48 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 6.90 Contact Pad to Center Pad (X44) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 ØV EV EV For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 48-Lead Plastic Quad Flat, No Lead Package (5E) - 7x7 mm Body [QFN] With 5.1x5.1 mm Exposed Pad; Punch Singulated, 0.40 mm Dimpled Terminals |
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