STM32F413CG datasheet(197/207 Pages) STMICROELECTRONICS

부품명	STM32F413CG

상세설명	ARM-Cortex-M4 32b MCUFPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs

PDF	207 Pages

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제조업체	STMICROELECTRONICS [STMicroelectronics]

홈페이지	http://www.st.com

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DocID029162 Rev 2

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STM32F413xG/H

Package information

205

Figure 82. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball

grid array recommended footprint

Note:

Non solder mask defined (NSMD) pads are recommended.

4 to 6 mils solder paste screen printing process.

Stencil opening is 0.400 mm.

Stencil thickness is between 0.100 mm and 0.125 mm.

Pad trace width is 0.120 mm.

0.550

0.600

0.650

0.0177

0.0197

0.0217

ddd

0.080

0.0039

eee

0.150

0.0059

fff

0.080

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 111. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA)

Dimension

Recommended values

Pitch

0.80 mm

Dpad

0.400 mm

Dsm

0.550 mm typ. (depends on the soldermask

registration tolerance)

Table 110. UFBGA144 - 144-ball, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid

array package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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