 |
전자부품 데이터시트 검색엔진 |
|
|
전자부품 데이터시트 검색엔진 |
|
LAN89730 데이터시트(PDF) 211 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
LAN89730 데이터시트(HTML) 211 Page - Microchip Technology |
|
|
211 / 218 page  2013-2015 Microchip Technology Inc. DS60001348A-page 211 LAN89730 RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 5.30 5.30 MILLIMETERS 0.50 BSC MIN E MAX 7.90 Contact Pad Length (X56) Contact Pad Width (X56) Y1 X1 0.85 0.30 Microchip Technology Drawing C04-2374A NOM SILK SCREEN 1 2 20 C1 Contact Pad Spacing 7.90 Contact Pad to Center Pad (X52) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: E EV EV C2 C1 X2 Y2 ØV Y1 G1 X1 56L Very Thin Quad Flat, No Lead Package (P6) - 8x8 mm Body [VQFN] With 5.2x5.2 mm Exposed Pad; Punch Singulated |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Korean ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
