TIME (sec)

180

℃

100

150

200

250

230

℃

PRE-HEATING TIME

SOLDERING TIME

MAX 250

℃

90 – 120sec

60secMAX

10secMAX

0

B220

DF3 Series

1. Recommended Temperature Profile (SMT)

2. Recommended Manual Soldering Condition (SMT)

3. Recommended Screen Thickness (SMT)

4. Board Warpage (SMT)

5. Recommended Soldering Condition (DIP)

6. Cleaning Condition

7. Connection Condition

8. Precations

[Applicable Conditions]

1.Peak temperature : a maximum of 250

ç for no more than 10 seconds

2.Heating unit : no less than 230

ç for no more than 60 seconds

3.Preheating unit : 150 to 180

ç for 90 to 120 seconds

4.Number of times : no more than 2 times

* Measurement is conducted at the contact lead part

As it may change depending on the conditions such as solder paste types,

manufacturers, PCB size, and other soldering materials, please fully check

the mounting conditions before use.

(Note 1) This temperature profile is a recommended value.

Soldering iron temperature : 290

±10ç, Soldering time: Within 3 seconds

0.15

to 0.2mm

Based on both connector edges, 0.03mm max. in the connector center portion

■Flow Condition with Automatic Soldering Tool. Soldering temperature : 250±5ç, Soldering time : Within 10 seconds

■Manual Soldering Condition. Soldering iron temperature : 290±10ç, Soldering time : Within 2 seconds

Refer to the "Wire-to-Board Connector Use Hand book".

IPA cleaning is allowed. (Cleaning is not recommended because cleaning may change the

push/pull feeling etc. Please contact us when you use other cleaning agents. )

Refer to the "Wire-to-Board Connector Use Hand book".

Refer to the "Wire-to-Board Connector Use Hand book".

BPrecautions