7

W.FL Series

80

100

120

140

160

180

200

220

240

260

[ç]

Preheat

(130 to 180ç)

230ç

220ç

50 seconds max.

120 seconds max.

60 seconds max.

Time

250 ç max. for

10 seconds

W.FL Cable

Assembly

W.FL-R-SMT-1

W.FL-LP-N plug extraction tool

W.FL

Cable Assembly

2N max

∞

∞

W.FL-R-SMT-1

Receptacle

Plug pickup

qw

e

r

t

Insertion to a receptacle Removal of the tool

BPrecautions

1. Plug

(1) Mating / unmating

• Unmating

Insert both ends of the extraction tool under the plug (from the direction opposite to the

Cable termination), as shown and pull-up in the direction perpendicular to the mounting

surface of the receptacle.

●Recomended the use of the extraction tool for unmating.

Any attempt of unmating by pulling on the cable may result in

damage and affect the mechanical / electrical performance.

• Mating

qAlign the mating tool W.FL-LP-IN or the mating end

of the tool over the plug end of the cable assembly.

wFirmly place the tool over the plug until it is secured

in the tool.

ePlace the plug cable assembly (held in the tool)over

the corresponding receptacle.

rAssuring that the plug and receptacle are aligned

press-down perpendicular to the mounting surface

until both connectors are fully mated.

tRemove the mating tool by carefully pulling it

up.Removal of the tool.

(2) Pull forces on the

cable after connectors

are mated

After the connectors are mating, do not apply a load to

the cable in excess of the values indicated in the

diagram.

(3) Precautions

Do not twist connectors excessively during mating / unmating.

2. Receptacle

(1) Recommended reflow

temperature profile

qThe temperature of the printed circuit board surface temperature at the points of contact with the terminals.

wReflow soldering should be performed at a printed circuit surface temperature of 250°C max.

eIn individual applications the actual temperature may vary, depending on the solder paste type, volume /

thickness and board size / thickness. Consuly your solder paste and equipment manufacturer for specific

recommendations.

(2) Recommended metal

mask thickness

0.1 mm to 0.12 mm

(3) Reflow cycles

2 times

3. Operating environment and storage conditions

(1) Operating

environment

The connectors are not designed to operate in the following environments:

• Exposed to a excessive amounts of fine particles and dust

• Regions and places having a high density of sulfur dioxide, hydrogen sulfide, nitrogen dioxide or other corrosive gasses.

• Environments having large rapid variations in temperature.

(2) Storage conditions -

Receptacle

Store in the Hirose Electric packaging.

Temperature: -10 to +40ç, Humidity: 85% max.

Use within 6 months of delivery.

Receptacles for which the storage period has elapsed must be tested for solderability to the PC board

mounting surface.