MK-R2 datasheet(9/14 Pages) CREE

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Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a

trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.

XLamp® mK-R2 LED

REFLow soLDERinG ChARACtERistiCs

In testing, Cree has found XLamp MK-R2 LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general

guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature

Lead-Free solder

Average Ramp-Up Rate (Ts

max to Tp)

1.2 °C/second

Preheat: Temperature Min (Ts

min)

120 °C

Preheat: Temperature Max (Ts

max)

170 °C

Preheat: Time (ts

min to tsmax)

65-150 seconds

Time Maintained Above: Temperature (T

217 °C

Time Maintained Above: Time (t

45-90 seconds

Peak/Classification Temperature (Tp)

235 - 245 °C

Time Within 5 °C of Actual Peak Temperature (tp)

20-40 seconds

Ramp-Down Rate

1 - 6 °C/second

Time 25 °C to Peak Temperature

4 minutes max.

Note: All temperatures refer to the topside of the package, measured on the package body surface.

IPC/JEDEC J-STD-020C

Time

t 25˚C to Peak

Preheat

Ramp-down

Ramp-up

Critical Zone

L to TP

max

min

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