TM

Suffix ThickneSS

(prior To Tinning)

flaTneSS &

paralleliSM

hoT

face

cold

face

lead

length

l

0.134”± 0.010”

0.0015” / 0.0015” Lapped

Lapped

4.5”

l1

0.134”± 0.001”

0.001” / 0.001”

Lapped

Lapped

4.5”

l2

0.134”± 0.0005”

0.0005” / 0.0005” Lapped

Lapped

4.5”

Ml

0.138”± 0.010”

0.002” / 0.002”

Metallized

Lapped

4.5”

lM

0.138”± 0.010”

0.002” / 0.002”

Lapped

Metallized

4.5”

MM

0.142”± 0.010”

0.002” / 0.002”

Metallized

Metallized

4.5”

Suffix SealanT color TeMp range deScripTion

rT

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

ep

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

Innovative Technology

for a Connected World

Ceramic Plate Series CP08,31,06

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.420530

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FeatureS

• PreciseTemperatureControl

• CompactGeometricSizes

• ReliableSolidStateOperation

• NoSoundorVibration

• EnvironmentallyFriendly

• DCOperation

• RoHSCompliant

aPPliCationS

• MedicalLasers

• LabScienceInstrumentation

• ClinicalDiagnosticSystems

• PhotonicsLaserSystems

• ElectronicEnclosureCooling

• Food&BeverageCooling

• Chillers(LiquidCooling)

TheCeramicPlate(CP)SeriesofThermoelectricModules(TEMs)isconsidered

‘thestandard’inthethermoelectricindustry.

Thisbroadproductlineofhigh-performanceandhighlyreliableTEMsisavailable

innumerousheatpumpingcapacities,geometricshapes,andinputpowerranges.

AssembledwithBismuthTelluridesemiconductormaterialandthermallyconductive

AluminumOxideceramics,theCPSeriesisdesignedforhighercurrentandlarge

heat-pumpingapplications.

perforMance SpecificaTionS

hot Side Temperature (°c)

25°C

50°C

Qmax (Watts)

4.5

4.9

delta Tmax (°c)

67

75

imax (amps)

2.1

2.1

Vmax (Volts)

3.7

4.0

Module resistance (ohms)

1.54

1.74

Sealing oPtion