TMP93CS41F datasheet(8/48 Pages) TOSHIBA

8 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-8

2002-02-20

2.1.1

Precaution for Dry Pack

Figure 2.2 shows the tray type of the dry

pack form. Precaution for handling dry pack

products are as follows.

x Do not toss or drop to avoid damaging the

devices and/or the moisture proof bag.

y Desiccant in the form of granulated silica

gel includes blue indicator beads which

become transparent when moisture is

present, such as if the bag is torn or opened.

In this case, the devices must be high

temperature baked to remove the moisture

prior to solder mounting.

z Store the pack at 30°C / 90%RH. After

opening the pack mount it the device within

12 months of the date on the seal. If the

30% humidity indicator is entirely pink

when the device unpacked, or when the 12-

month duration has expired treat the

device before use at high temperature (bake

it at more than 125

°C for 20h) to remove

moisture.

{ How quickly a product should be used after

the pack is opened depends of the product.

See Tables 2-2 and 2-3 for details.

If the

time limit for use has expired when devices

are unpacked, they should be baked.

| Devices in heat-proof trays should be baked

at 125

°C for at least 20h.

Heat-proof trays bear the mold marking

“HEAT PROOF” .

Be careful not to bend the leads when

baking devices.

} Binding trays using a plastic tapes

If trays are rebound with plastic tapes after

having been untied, two tapes should be

used as shown in Figure 2.2 (a). If a tape is

tied lengthwise along the trays the tray

edges may break.

Figure 2.2

SMDs Dry pack Form

(a) Method

Heat-proof tray (occasionally non-heat-proof)

Moisture proof bag

(Aluminum laminate)

Heat proof tray

Corrugated

cardboard box

Heat seal

Turn under

Label

Plastic band

Indicator

Silica gel

(b) Shipping carton

Sealing tape

Corrugated

cardboard box

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