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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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FT240XS-R 데이터시트(PDF) 31 Page - Future Technology Devices International Ltd. |
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FT240XS-R 데이터시트(HTML) 31 Page - Future Technology Devices International Ltd. |
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31 / 40 page  Copyright © 2013 Future Technology Devices International Limited 31 FT240X USB 8-BIT FIFO IC Datasheet Version 1.3 Document No.: FT_000626 Clearance No.: FTDI# 259 9 Package Parameters The FT240X is available in two different packages. The FT240XS is the SSOP-24 option and the FT240XQ is the QFN-24 package option. The solder reflow profile for both packages is described in Section 9.5. 9.1 SSOP-24 Package Mechanical Dimensions Figure 9.1 SSOP-24 Package Dimensions The FT240XS is supplied in a RoHS compliant 24 pin SSOP package. The package is lead (Pb) free and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 8.66mm x 3.91 mm body (8.66mm x 5.99mm including pins). The pins are on a 0.635 mm pitch. The above mechanical drawing shows the SSOP-24 package. The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. The code XXXXXXXXXXXX is the manufacturing LOT code. |
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