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FT4222HQ-C-R 데이터시트(PDF) 42 Page - Future Technology Devices International Ltd. |
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FT4222HQ-C-R 데이터시트(HTML) 42 Page - Future Technology Devices International Ltd. |
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42 / 49 page ![]() Copyright © Future Technology Devices International Limited 42 FT4222H USB2.0 TO QUADSPI/I2C BRIDGE IC 1.3 Document No.: FT_001011 Clearance No.: FTDI#405 10 Package Parameters The FT4222H is available in a VQFN-32 package. The solder reflow profile for VQFN-32 is described in Section 10.3. 10.1 VQFN-32 Package Mechanical Dimensions Figure 10.1 VQFN-32 Package Dimensions The FT4222H is supplied in a RoHS compliant leadless VQFN-32 package. The package is lead (Pb) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.5mm pitch. The above mechanical drawing shows the VQFN-32 package. All dimensions are in millimetres. The centre pad on the base of the FT4222H is internally connected to GND and the PCB should not have signal tracking on the top layer under this area. Connect to GND. |
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