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FERD30S50 데이터시트(PDF) 5 Page - STMicroelectronics |
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FERD30S50 데이터시트(HTML) 5 Page - STMicroelectronics |
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5 / 8 page ![]() Doc ID024715 Rev 2 5/8 FERD30S50 Package information 8 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. PowerFLAT-8L dimensions (definitions) Table 5. PowerFLAT-8L dimensions (values) Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.02 0.05 0.001 0.002 A2 0.25 0.010 b 0.30 0.50 0.012 0.020 D 5.20 0.205 D2 4.11 4.31 0.162 0.170 e 1.27 0.050 E 6.15 0.242 E2 3.50 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.275 1.575 0.050 0.062 D2 E2 K L b e D E A A1 A2 |
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