STM8L151X6 datasheet(112/142 Pages) STMICROELECTRONICS

112 / 142 page

Electrical parameters

STM8L151x4/6, STM8L152x4/6

112/142

DocID15962 Rev 15

Figure 40. Maximum dynamic current consumption on VREF+ supply pin during ADC

conversion

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 41 or Figure 42,

depending on whether VREF+ is connected to VDDA or not. Good quality ceramic 10 nF

capacitors should be used. They should be placed as close as possible to the chip.

ADC clock

Sampling (n cycles)

Conversion (12 cycles)

Iref+

300µA

700µA

Table 57. RAIN max for fADC = 16 MHz(1)

(cycles)

(µs)

RAIN max (kohm)

Slow channels

Fast channels

2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.3 V 1.8 V < VDDA < 2.4 V

0.25

Not allowed

0.7

Not allowed

0.5625

0.8

Not allowed

2.0

1.0

2.0

0.8

4.0

3.0

1.5

3.0

1.8

6.0

4.5

6.8

4.0

15.0

10.0

15.0

10.0

30.0

20.0

192

32.0

25.0

50.0

40.0

384

50.0

1. Guaranteed by design.

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