STM32F098CC datasheet(110/128 Pages) STMICROELECTRONICS

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Package information

STM32F098CC STM32F098RC STM32F098VC

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DocID026967 Rev 4

Figure 43. Recommended footprint for WLCSP64 package

b(2)

0.220

0.250

0.280

0.0087

0.0098

0.0110

3.312

3.347

3.382

0.1304

0.1318

0.1331

3.550

3.585

3.620

0.1398

0.1411

0.1425

0.400

0.0157

2.800

0.1102

2.800

0.1102

0.2735

0.0108

0.3925

0.0155

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 74. WLCSP64 recommended PCB design rules

Dimension

Recommended values

Pitch

0.4

Dpad

260 µm max. (circular)

220 µm recommended

Dsm

300 µm min. (for 260 µm diameter pad)

PCB pad design

Non-solder mask defined via underbump allowed.

Table 73. WLCSP64 package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

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