STM32L062T8 datasheet(103/118 Pages) STMICROELECTRONICS

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DocID025937 Rev 8

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STM32L062x8

Package information

112

Figure 35. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

Table 74. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to the 3rd decimal place.

Min

Typ

Max

Min

Typ

Max

0.33

0.013

0.10

0.004

0.20

0.008

0.025(2)

2. Back side coating. Nominal dimension rounded to the 3rd decimal place results from process capability.

0.001

0.16

0.19

0.22

0.006

0.007

0.009

2.59

2.61

2.63

0.102

0.103

0.104

2.86

2.88

2.90

0.112

0.113

0.114

0.40

0.016

2.00

0.079

2.00

0.079

0.305(3)

3. Calculated dimensions are rounded to 3rd decimal place.

0.012

0.440(3)

0.017

aaa

0.10

0.004

bbb

0.10

0.004

ccc

0.10

0.004

ddd

0.05

0.002

eee

0.05

0.002

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