STA559BW datasheet(63/67 Pages) STMICROELECTRONICS

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STA559BW

Package thermal characteristics

Using a double-layer PCB the thermal resistance, junction to ambient, with 2 copper ground

areas of 3 x 3 cm2 and with 16 via holes is 24 °C/W in natural air convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

Thus, the maximum estimated dissipated power for the STA559BW is:

Figure 20 shows the power derating curve for the PowerSSO-36 package on PCBs with

copper areas of 2 x 2 cm2 and 3 x 3 cm2.

Figure 20. PowerSSO-36 power derating curve

2 x 20 W @ 8

, 18 V

Pd max is approximately 4 W

2 x 9 W + 1 x 20 W @ 4

, 8 ,18 V

Pd max is approximately 5 W

2040

6080

100

120

140

160

2040

6080

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA339BW

PSSO36

Copper Area 3x3 cm

and via holes

2040

6080

100

120

140

160

2040

6080

100

120

140

160

2040

6080

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA339BW

PSSO36

Copper Area 3x3 cm

and via holes

STA559BW

PowerSSO-

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