SM5009 series

NIPPON PRECISION CIRCUITS INC.—2

PAD LAYOUT

(Unit:

µm)

PINOUT

(Top view)

PIN DESCRIPTION and PAD DIMENSIONS

Chip size: 0.92

× 1.22 mm

Chip thickness: 300 ± 30 µm

Q

VDD

XT

VSS

(0,0)

(920,1220)

X

Y

INH

XT

1

XT

VSS

Q

VDD

4

2

3

NC

NC

8

7

6

5

XT

INH

Number

Name

I/O

Description

Pad dimensions [µm]

XY

1INH

I

Output state control input. Standby mode when LOW, pull-up resistor built-in.

In the case of the CF5009AL

×, the oscillator stops and power-save pull-up

resistor built in to reduce current consumption at standby mode.

195

212

2

XT

I

Amplifier input.

Crystal oscillator connection pins.

Crystal oscillator connected between XT and XT

385

212

3XT

O

Amplifier output.

575

212

4

VSS

–

Ground

766

212

5Q

O

internal connection

765

1062

6

NC

–

No connection

–

–

7

NC

–

No connection

–

–

8

VDD

–

Supply voltage

162

1062