AD7761BSTZ datasheet(16/76 Pages) AD

16 / 76 page

Data Sheet

AD7761

Rev. A | Page 15 of 75

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

AVDD1, AVDD2 to AVSS1

−0.3 V to +6.5 V

AVDD1 to DGND

−0.3 V to +6.5 V

IOVDD to DGND

−0.3 V to +6.5 V

IOVDD, DREGCAP to DGND (IOVDD Tied

to DREGCAP for 1.8 V Operation)

−0.3 V to +2.25 V

IOVDD to AVSS

−0.3 V to +7.5 V

AVSS to DGND

−3.25 V to +0.3 V

Analog Input Voltage to AVSS

−0.3 V to AVDD1 + 0.3 V

Reference Input Voltage to AVSS

−0.3 V to AVDD1 + 0.3 V

Digital Input Voltage to DGND

−0.3 V to IOVDD + 0.3 V

Digital Output Voltage to DGND

−0.3 V to IOVDD + 0.3 V

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Pb-Free Temperature, Soldering

Reflow (10 sec to 30 sec)

260°C

Maximum Junction Temperature

150°C

Maximum Package Classification

Temperature

260°C

1 Transient currents of up to 100 mA do not cause silicon controlled rectifier

(SCR) latch-up.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. Careful attention to PCB thermal

design is required.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

JEDEC Board Layers

ST-64-2

9.2

°C/W

2P2S1

1 2P2S is a JEDEC standard PCB configuration per JEDEC Standard JESD51-7.

ESD CAUTION

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