| 전자부품 데이터시트 검색엔진 |
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ADP1610ARMZ-R7 데이터시트(PDF) 15 Page - Analog Devices |
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ADP1610ARMZ-R7 데이터시트(HTML) 15 Page - Analog Devices |
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15 / 16 page ![]() ADP1610 Rev. 0 | Page 15 of 16 LAYOUT PROCEDURE To get high efficiency, good regulation, and stability, a well- designed printed circuit board layout is required. Where possible, use the sample application board layout as a model. Follow these guidelines when designing printed circuit boards (see Figure 1): • Keep the low ESR input capacitor, CIN, close to IN and GND. • Keep the high current path from CIN through the inductor L1 to SW and PGND as short as possible. • Keep the high current path from CIN through L1, the rectifier D1, and the output capacitor COUT as short as possible. • Keep high current traces as short and as wide as possible. • Place the feedback resistors as close to the FB pin as possible to prevent noise pickup. • Place the compensation components as close as possible to COMP. • Avoid routing high impedance traces near any node connected to SW or near the inductor to prevent radiated noise injection. Figure 31. Sample Application Board (Bottom Layer) Figure 32. Sample Application Board (Top Layer) Figure 33. Sample Application Board (Silkscreen Layer) |
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