PC755CMZFU366LE datasheet(17/50 Pages) ATMEL

17 / 50 page

PC755/745

2138D–HIREL–06/03

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of RÉýJC for the part is less than 0.1

°C/W.

Note:

Refer to Section “Thermal Management Information“ page 19 for more details about thermal management.

Package Thermal

Characteristics for HiTCE

Table 7 provides the package thermal characteristics for the PC755, HiTCE.

Notes:

1. Simulation, no convection air flow.

2. Per JEDEC JESD51-6 with the board horizontal.

The board designer can choose between several types of heat sinks to place on the

PC755. There are several commercially-available heat sinks for the PC755 provided by

the following vendors:

For the exposed-die packaging technology, shown in Table 5, the intrinsic conduction

thermal resistance paths are as follows:

•

The die junction-to-case (or top-of-die for exposed silicon) thermal resistance

•

The die junction-to-ball thermal resistance

Figure 6 depicts the primary heat transfer path for a package with an attached heat sink

mounted to a printed-circuit board.

Heat generated on the active side of the chip is conducted through the silicon, then

through the heat sink attach material (or thermal interface material), and finally to the

heat sink where it is removed by forced-air convection.

Since the silicon thermal resistance is quite small, for a first-order analysis, the tempera-

ture drop in the silicon may be neglected. Thus, the heat sink attach material and the

heat sink conduction/convective thermal resistances are the dominant terms.

Table 7. Package Thermal Characteristics for HiTCE Package

Characteristic

Symbol

Value

Unit

PC755 HiTCE

Junction-to-bottom of balls(1)

6.8

°C/W

Junction-to-ambient thermal resistance, natural

convection, four-layer (2s2p) board(1)(2)

JMA

20.7

°C/W

Junction to board thermal resistance

11.0

°C/W

Table 8. Package Thermal Characteristics for CI-CGA

Characteristic

Symbol

Value

Unit

PC755 CI-CGA

Junction to board thermal resistance

8.42

°C/W

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