MB91F585ASH datasheet(33/176 Pages) CYPRESS

33 / 176 page

Document Number: 002-04665 Rev *A

Page 32 of 175

MB91580M/S Series

 Fail-Safe Design

Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss

from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire

protection, and prevention of over-current levels and other abnormal operating conditions.

 Precautions Related to Usage of Devices

Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other

office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).

CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation

may directly affect human lives or cause physical injury or property damage, or where extremely high levels of

reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating

controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use.

The company will not be responsible for damages arising from such use without prior approval.

5.2

Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during

soldering, you should only mount under Cypress's recommended conditions. For detailed information about mount

conditions, contact your sales representative.

 Lead Insertion Type

Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on

the board, or mounting by using a socket.

Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and

using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually

causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting

processes should conform to Cypress recommended mounting conditions.

If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to

contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket

contacts and IC leads be verified before mounting.

 Surface Mount Type

Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more

easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased

susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.

You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established

a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress

ranking of recommended conditions.

 Lead-Free Packaging

CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering,

junction strength may be reduced under some conditions of use.

 Storage of Semiconductor Devices

Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause

absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause

surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following:

1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store

products in locations where temperature changes are slight.

2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures

between 5°C and 30°C.

When you open Dry Package that recommends humidity 40% to 70% relative humidity.

3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags,

with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.

4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.

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