MB91F522DKBPMC datasheet(42/280 Pages) CYPRESS

42 / 280 page

Document Number: 002-04662 Rev. *F

Page 42 of 280

MB91520 Series

absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause

surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following:

(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in

locations where temperature changes are slight.

(2) Use dry boxes for product storage. Products should be stored below 70 % relative humidity, and at temperatures

between 5 °C and 30 °C.

When you open Dry Package that recommends humidity 40 % to 70 % relative humidity.

(3) When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a

silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.

(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.

 Baking

Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended

conditions for baking.

Condition: 125 °C/24 h

 Static Electricity

Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following

precautions:

(1) Maintain relative humidity in the working environment between 40 % and 70 %. Use of an apparatus for ion generation

may be needed to remove electricity.

(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.

(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the

level of 1 M

Ω).

Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is

recommended.

(4) Ground all fixtures and instruments, or protect with anti-static measures.

(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.

3. Precautions for Use Environment

Reliability of semiconductor devices depends on ambient temperature and other conditions as described above.

For reliable performance, do the following:

(1) Humidity

Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are

anticipated, consider anti-humidity processing.

(2) Discharge of Static Electricity

When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such

cases, use anti-static measures or processing to prevent discharges.

(3) Corrosive Gases, Dust, or Oil

Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the

device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices.

(4) Radiation, Including Cosmic Radiation

Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should

provide shielding as appropriate.

(5) Smoke, Flame

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