CS43L36 datasheet(88/89 Pages) CIRRUS

88 / 89 page

DS1081F3

CS43L36

11 Thermal Characteristics

12 Ordering Information

13 References

• NXP Semiconductors, UM10204 Rev. 06, April 2014, The I2C-Bus Specification and User Manual, http://

www.nxp.com

• JEDEC Solid State Technology Association, Guidelines for Reporting and Using Electronic Package Thermal

Information, JEDEC Standard No. 51-12.01, November 2012, http://www.jedec.org/

Table 11-1. Typical JEDEC Four-Layer, 2s2p Board Thermal Characteristics

Parameter 1

1.Thermal setup:

Still air @ maximum allowed ambient temperature

JEDEC 2s2p printed wiring board (JEDEC Standard JESD51-11, June 2001)

Size: 114.5 x 101.5 x 1.6 mm

Symbol

QFN

WLCSP

Unit

Junction-to-ambient thermal resistance

JA

35.0

52.0

°C/W

Junction-to-board thermal resistance

JB

9.0

17.8

°C/W

Junction-to-case thermal resistance

JC

0.98

0.15

°C/W

Junction-to-board thermal-characterization parameter

JB

8.9

17.7

°C/W

Junction-to-package-top thermal-characterization parameter

JT

0.19

0.04

°C/W

Table 12-1. Ordering Information1

1.The Revision ID fields in Section 7.1.1, “Revision ID,” list the alpha (AREVID) and metal (MTLREVID) revision

Product

Description

Package

RoHS

Compliant

Grade

Temperature

Range

Container

Order #

CS43L36 Low-Power,

High-Performance

Audio DAC with

Class H

Headphone Drivers

40-pin QFN

Yes

Extended

Commercial

–40 to +85°C

Tape and reel

CS43L36-CNZR

Tray

CS43L36-CNZ

49-ball

WLCSP

Yes

Extended

Commercial

–40 to +85°C

Tape and reel

CS43L36-CWZR

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