AD8260ACPZ-R7 datasheet(32/32 Pages) AD

32 / 32 page

AD8260

Data Sheet

Rev. B | Page 32 of 32

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.20 MIN

2.85

2.70 SQ

2.55

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-2.

Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-21)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature

Package Description

Package Option

AD8260ACPZ-R7

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

AD8260ACPZ-RL

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

AD8260ACPZ-WP

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

AD8260-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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D07192-0-5/16(B)

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