STV0684 datasheet(46/49 Pages) STMICROELECTRONICS

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Package Information

STV0684

46/49

5.2

STV0684 package mechanical data

Note: 1 The maximum mounted height is 1.57 mm based on a 0.37 mm ball pad diameter.

Solder paste is 0.15 mm thick with 0.37 mm ball pad diameter.

2 LFBGA stands for Low Profile Fine Pitch Ball Grid Array.

Low profile: The total profile height (Dim A) is measured from the seating plane to the top of the

component. A = [1.21 to 1.70] mm

FIne pitch: e<1.00 mm pitch.

3 The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or

metallized markings or other features of package body or integral heatslug.

A distinguishing feature can be added on the bottom surface of the package to identify the terminal

A1 corner.

Exact shape of each corner is optional.

Reference

Dimensions (mm)

Min.

Typ.

Max.

1.210

1.700

0.270

1.120

0.450

0.500

0.550

11.850

12.000

12.150

10.400

11.850

12.000

12.150

10.400

0.720

0.800

0.880

0.650

0.800

0.950

ddd

0.120

STV0684 데이터시트(PDF) 46 Page - STMicroelectronics

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