STTH2R06 datasheet(3/9 Pages) STMICROELECTRONICS

3 / 9 page

STTH2R06

3/9

Figure 1: Conduction losses versus average

forward current

Figure 2: Forward voltage drop versus forward

current

Figure

Relative

variation

thermal

impedance junction to case versus pulse

duration (SMA/SMB/SMC: SCU = 1cm

Figure 4: Peak reverse recovery current

versus dIF/dt (typical values)

Figure 5: Reverse recovery time versus dIF/dt

(typical values)

Figure 6: Reverse recovery charges versus

dIF/dt (typical values)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

P(W)

(A)

F(AV)

δ=tp/T

δ = 0.05

δ = 0.1

δ = 0.2

δ = 1

δ = 0.5

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

2.25

2.50

2.75

3.00

(A)

(V)

T =150°C

(typical values)

T =25°C

(maximum values)

T =150°C

(maximum values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-a)

Single pulse

t (s)

SMA

DO-41

SMC

SMB

100

150

200

250

300

350

400

450

500

(A)

dI /dt(A/µs)

I =2 x I

FF(AV)

I=I

F(AV)

I =0.5 x I

F(AV)

V =400V

T =125°C

100

150

200

250

300

100

150

200

250

300

350

400

450

500

t (ns)

dI /dt(A/µs)

I =2 x I

F(AV)

I=I

F(AV)

I =0.5 x I

F(AV)

V =400V

T =125°C

100

150

200

250

300

350

400

100

200

300

400

500

Q (nC)

I =2 x I

FF(AV)

I =0.5 x I

F(AV)

dI /dt(A/µs)

I=I

FF(AV)

V =400V

T =125°C

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