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IP4856CX25/C 데이터시트(PDF) 2 Page - Nexperia B.V. All rights reserved

부품명 IP4856CX25/C
상세설명  SD 3.0-compliant memory card integrated dual voltage level translator with EMI filter and ESD protection
PDF  22 Pages
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제조업체  NEXPERIA [Nexperia B.V. All rights reserved]
홈페이지  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

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1.
General description
The device is an SD 3.0-compliant 6-bit bidirectional dual voltage level translator. It is
designed to interface between a memory card operating at 1.8 V or 2.9 V signal levels and
a host with a fixed nominal supply voltage of 1.7 V to 3.6 V. The device supports SD 3.0,
SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 high-speed (50 MHz) and
default-speed (25 MHz) modes. The device has an integrated voltage selectable low
dropout regulator to supply the card-side I/Os, built-in EMI filters and robust ESD
protections (IEC 61000-4-2, level 4).
2.
Features and benefits
Supports up to 208 MHz clock rate
Feedback channel for clock synchronization
SD 3.0 specification-compliant voltage translation to support SDR104, SDR50,
DDR50, SDR25, SDR12, high-speed and default-speed modes
100 mA low dropout voltage regulator to supply the card-side I/Os
Low power consumption by push-pull output stage with break-before-make
architecture
Integrated pull-up and pull-down resistors: no external resistors required
Integrated EMI filters suppress higher harmonics of digital I/Os
Integrated 8 kV ESD protection according to IEC 61000-4-2, level 4 on card side
Level shifting buffers keep ESD stress away from the host (zero-clamping concept)
25-ball WLCSP; pitch 0.4 mm
3.
Applications
4.
Ordering information
IP4856CX25/C
SD 3.0-compliant memory card integrated dual voltage level
translator with EMI filter and ESD protection
Rev. 2 — 15 October 2014
Product data sheet
Smartphones
Tablet PCs
Mobile handsets
Laptop computers
Digital cameras
SD, MMC or microSD card readers
Table 1.
Ordering information
Type number
Package
Name
Description
Version
IP4856CX25/C
WLCSP25
wafer level chip-size package with back side coating;
25 bumps (5
 5); typical size: 2.05 mm  2.05 mm  0.51 mm
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