TFP503

PanelBus HDCP DIGITAL RECEIVER

SLDS149 − AUGUST 2004

24

POST OFFICE BOX 655303

MECHANICAL DATA

PZP (S-PQFP-G100)

PowerPAD

 PLASTIC QUAD FLATPACK

0,13 NOM

50

26

Thermal Pad

(see Note D)

0,75

0,45

0,25

Seating Plane

4146929/A 04/99

Gage Plane

0,27

75

0,17

76

100

SQ

SQ

1

15,80

16,20

14,20

13,80

12,00 TYP

1,05

0,95

1,20 MAX

51

25

0,50

M

0,08

0,08

0

°−7°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments.