AT21CS01 datasheet(38/47 Pages) MICROCHIP

38 / 47 page

DRAWING NO.

REV.

TITLE

GPC

2MS-1

10/14/14

2MS-1, 2-pad 5.0x3.5 mm Body, 0.40 thick,

Extra Thin Single Flat No Lead Package (XSFN)

YDR

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

TYP

MAX

NOTE

0.30

0.35

0.40

0.00

0.035

0.05

0.127 REF

1.05

1.10

1.15

4.55

4.60

4.65

5.00 BSC

3.50 BSC

2.00 BSC

0°

0.90 REF

Notes:

1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.

2. All dimensions are in millimeters, 0 is in degrees.

3. Dimension ‘b’ applies to metallized terminal and is measured between 0.15

and 0.30mm from terminal tip. If the terminal has the optional radius on the

other end of the terminal, the dimension ‘b’ should not be measured in that

radius area.

4. Maximum package warpage is 0.05mm.

5. Maximum allowable burrs is 0.076mm in all directions.

6. Pin #1 on top will be laser marked.

7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as

the terminals.

0.10 m C A B

0.05

TOP VIEW

BOTTOM VIEW

(DATUM A)

k 0.10 C

Pin1 Corner

(DATUM B)

SEATING PLANE

SIDE VIEW

C0.60 X 45°

0.200

Pin1 Corner

k 0.050 C

h 0.10 C

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging.

AT21CS01/AT21CS11

Datasheet

DS20005857A-page 38

AT21CS01 데이터시트(PDF) 38 Page - Microchip Technology

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