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AT21CS01 데이터시트(PDF) 39 Page - Microchip Technology

부품명 AT21CS01
상세설명  Single-Wire, I/O Powered 1-Kbit (128 x 8) Serial EEPROM with a Unique, Factory-Programmed 64-Bit Serial Number
PDF  47 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

AT21CS01 데이터시트(HTML) 39 Page - Microchip Technology

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AT21CS01 [DATASHEET]
Atmel-8903A-SEEPROM-AT21CS01-Datasheet_082015
34
12.2 3ST1 — 3-lead SOT23
TITLE
DRAWING NO.
GPC
REV.
3TS1
12/11/09
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
End View
Side View
Top View
3TS1, 3-lead, 1.30mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
B
TBG
0.89
0.01
0.88
2.80
2.10
1.20
0.30
A
A1
A2
D
E
E1
L1
e1
b
-
-
-
2.90
-
1.30
0.54 REF
1.90 BSC
-
1.12
0.10
1.02
3.04
2.64
1.40
0.50
1,2
1,2
3
Notes:
1. Dimension D does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.25mm per end. Dimension E1 does not include interlead flash
or protrusion. Interlead flash or protrusion shall not exceed
0.25mm per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are determined at the outermost extremes
of the plastic body exclusive of mold flash, tie bar burrs, gate
burrs and interlead flash, but including any mismatch between
the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between
0.08 mm and 0.15mm from the lead tip.
This drawing is for general information only. Refer to JEDEC
Drawing TO-236, Variation AB for additional information.
CL
3
E
E1
1
2
e1
SEATING
PLANE
b
A2
A
A1
e
D
GND
SDA
VCC
Note:  For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
AT21CS01/AT21CS11
© 2017 Microchip Technology Inc.
Datasheet
DS20005857A-page 39



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