TLE9461ES datasheet(8/140 Pages) INFINEON

8 / 140 page

Datasheet

Rev.1.1

2019-09-27

TLE9461ES

Lite CAN SBC Family

Pin Configuration

Note:

Both VS Pins must be connected to same battery potential;

all GND pins as well as the Cooling Tab must be connected to one common GND potential

9RSTN

Reset Output; active low, internal pull-up

TEST

Test Pin; Connect to GND or leave open for normal user mode operation;

Connect to VCC1 at device power-on to activate SBC Development Mode

(see Chapter 5.1.7). Integrated pull-down resistor.

GND

Ground; LDO 1 Power GND

VIO

Digital I/O Pin Voltage Supply; Must be connected to the buffered VCC1 voltage

(see also Figure 44)

VCC1

Voltage Regulator 1 Output

n.c.

not connected; internally not bonded

Supply Voltage; Supply for VCC1 power stage - both VS pins must be connected

together on same battery potential for proper operation; Connect to battery

voltage via reverse polarity protection diode and filter against EMC

Supply Voltage; Main supply of device - both VS pins must be connected

together on same battery potential for proper operation; Connect to battery

voltage via reverse polarity protection diode and filter against EMC

VCP

Charge Pump Output; For driving the gate of external N-channel MOSFETs, e.g.

for reverse polarity protection or Kl.30 load switch. Always place a 1kΩ resistor

in series for protection

WK/VSENSE

Wake Input;

Sense Input; Alternative function: HV-measurement function input

FO/GPIO

Fail Output; Open Drain Output, active low;

GPIO; Alternative function: configurable pin as WK, LS-, or HS-witch supplied by

VS (default is FO, see also Chapter 11.1.1)

Sense Output; Alternative function: if HV-measurement function is configured

VCC2

Voltage Regulator 2 Output

GND

Ground; Analog GND

GND

Ground; CAN GND

CANH

CAN High Bus Pin

CANL

CAN Low Bus Pin

Cooling

Tab

GND

Cooling Tab - Exposed Die Pad; For cooling purposes only, connect to but do not

use as an electrical ground1)

1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB.

The exposed die pad is not connected to any active part of the IC. However, it should be connected to GND for the

best EMC performance.

Symbol

Function

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