PACKAGE OUTLINE

SOP8-PP PACKAGE OUTLINE AND DIMENSIONS

In order to increase the driver current capability of HM5031 Series and improve the

temperature of package, Please ensure Epad and enough ground PCB to release

energy.

SYMBOL Dimension in

Millimeters

Dimension in

Inches

MIN

MAX

MIN

MAX

A

1.300 1.700 0.051 0.067

A1

0.000 0.100

0.0

0.004

A2

1.350 1.550 0.053 0.061

B

0.330 0.510 0.013 0.020

C

0.170 0.250 0.007 0.010

D

4.700 5.100 0.185 0.201

E

3.800 4.000 0.150 0.157

E1

5.800 6.200 0.228 0.244

e

1.27 TYP

0.050 TYP

L

0.400 1.270 0.016 0.050

θ

F

2.313 2.513 0.091 0.099

G

3.202 3.402 0.126 0.134

HM5031