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L99LD02 데이터시트(PDF) 60 Page - STMicroelectronics |
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L99LD02 데이터시트(HTML) 60 Page - STMicroelectronics |
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60 / 66 page ![]() Package and PCB thermal data L99LD02 60/66 DS12448 Rev 3 7 Package and PCB thermal data 7.1 QFN-32L 5x5 thermal data Figure 11. QFN-32L 5x5 on four-layers PCB Top layer: 95% of the area Bottom layer: 95% of the area Cu on mid1 layer: 1% of the area Cu on mid2 layer: 1% of the area Table 42. PCB proprieties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 129 mm x 60 mm Board material FR4 Copper thickness (outer layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm |
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