STM32F334C8U6TR datasheet(97/125 Pages) STMICROELECTRONICS

97 / 125 page

DS9994 Rev 9

97/125

STM32F334x4 STM32F334x6 STM32F334x8

Electrical characteristics

103

Figure 31. Typical connection diagram using the ADC

1. Refer to Table 64 for the values of RAIN.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this,

fADC must be reduced.

General PCB design guidelines

Power supply decoupling must be performed as shown in Figure 12: Power-supply scheme.

The 10 nF capacitor must be ceramic (good quality) and it must be placed as close as

possible to the chip.

6.3.20

DAC electrical specifications

12-bit

converter

Sample and hold ADC

converter

RAIN(1)

AINx

VAIN

Cparasitic

VDD

0.6 V

IL ± 1 μA

RADC

CADC

MS19881V3

Table 69. DAC characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

VDDA

Analog supply voltage

2.4

3.6

RLOAD(1) Resistive load

DAC output buffer ON (to VSSA)5

-k

DAC output buffer ON (to VDDA)25

RO(1)

Output impedance

DAC output buffer OFF

CLOAD(1) Capacitive load

DAC output buffer ON

VDAC_OUT(

Voltage on DAC_OUT

output

Corresponds to 12-bit input code

(0x0E0) to (0xF1C) at VDDA = 3.6 V

and (0x155) and (0xEAB) at VDDA =

2.4 V

0.2

VDDA – 0.2

DAC output buffer OFF

-0.5

VDDA– 1LSB

IDDA(3)

DAC DC current

consumption in quiescent

mode(2)

With no load, middle code (0x800)

on the input

380

µA

With no load, worst code (0xF1C) on

the input.

480

µA

STM32F334C8U6TR 데이터시트(PDF) 97 Page - STMicroelectronics

STM32F334C8U6TR 데이터시트(HTML) 97 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

데이터시트 다운로드

링크 URL