VITESSE

SEMICONDUCTOR CORPORATION

Data Sheet

VSC880

High Performance 16x16

Serial Crosspoint Switch

G52191-0, Rev 4.2

Page 27

01/05/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Package Thermal Characteristics

The VSC880 is packaged in a thermally enhanced 31mm 304TBGA with an embedded heat sink. The heat sink

surface configurations are shown in the package drawings. With natural convection, the junction to case thermal

Table 12.3. Note: The VSC880 is not guaranteed to operate under cold start conditions. If the ambient temperature is

equilibrium and ready for operation.

Table 8: Theta Junction-to-Ambient versus Air Velocity

Ordering Information

The order number for this product is formed by a combination of the device number and package type.

Air Velocity

(LFPM)

Junction-to-Ambient Thermal Resistance

(

Low Conductivity

2-Layer Board

High Conductivity

4-Layer Board

0

17.5

13.0

100

15.0

11.0

200

13.0

10.0

400

11.0

9.0

600

10.0

8.0

High Performance 16x16

VSC880 xx

Device Type

Package

TY: 304 BGA

Extended Commerical Temperature: 0°C ambient to +85°C case

Serial Crosspoint Switch

Notice

Vitesse Semiconductor Corporation (“Vitesse”) provides this document for informational purposes only. All information in this document, includ-

ing descriptions of features, functions, performance, technical specifications and availability, is subject to change without notice at any time. Noth-

ing contained in this document shall be construed as extending any warranty or promise, express or implied, that any Vitesse product will be

available as described or will be suitable for or will accomplish any particular task.

Vitesse products are not intended for use in life support appliances, devices or systems. Use of a Vitesse product in such applications without writ-

ten consent is prohibited.