SC3200 datasheet(439/447 Pages) AMD

439 / 447 page

AMD Geode™ SC3200 Processor Data Book

439

Package Specifications

Revision 5.1

10.0Package Specifications

10.1

Thermal Characteristics

The junction-to-case thermal resistance (

JC) of the pack-

ages shown in Table 10-1 can be used to calculate the

junction (die) temperature under any given circumstance.

Note that there is no specification for maximum junction

temperature given since the operation of the device is

guaranteed to a case temperature range of 0

°C to 85°C

(see Table 9-3 on page 370). As long as the case tempera-

ture of the device is maintained within this range, the junc-

tion temperature of the die will also be maintained within its

allowable operating range. However, the die (junction) tem-

perature under a given operating condition can be calcu-

lated by using the following equation:

TJ = TC + (P * θJC)

where:

TJ = Junction temperature (°C)

TC = Case temperature at top center of package (°C)

P = Maximum power dissipation (W)

JC = Junction-to-case thermal resistance (°C/W)

These examples are given for reference only. The actual

value used for maximum power (P) and ambient tempera-

ture (TA) is determined by the system designer based on

system configuration, extremes of the operating environ-

ment, and whether active thermal management (via Sus-

pend Modulation) of the GX1 module is employed.

A maximum junction temperature is not specified since a

maximum case temperature is. Therefore, the following

equation can be used to calculate the maximum thermal

resistance required of the thermal solution for a given max-

imum ambient temperature:

where:

CS = Max case-to-heatsink thermal resistance (°C/W)

allowed for thermal solution

SA = Max heatsink-to-ambient thermal resistance (°C/W)

allowed for thermal solution

TA = Max ambient temperature (°C)

TC = Max case temperature at top center of package (°C)

= Maximum power dissipation (W)

If thermal grease is used between the case and heatsink,

CS will reduce to about 0.01 °C/W. Therefore, the above

equation can be simplified to:

where:

CA = θSA = Max heatsink-to-ambient thermal resistance

(

°C/W) allowed for thermal solution

The calculated

CA value (examples shown in Table 10-2)

represents the maximum allowed thermal resistance of the

selected cooling solution which is required to maintain the

maximum TCASE (shown in Table 9-3 on page 370) for the

application in which the device is used.

Table 10-1.

JC (×C/W)

Package

Max (

°C/W)

EBGA

TEPBGA

CS + θSA =

TC − TA

CA =

TC − TA

Table 10-2. Case-to-Ambient Thermal Resistance Example @ 85

°C

Core Voltage

(VCORE)

(Nominal)

Core

Frequency

Maximum

Power (W)

CA for Different Ambient Temperatures (°C/W)

°C25°C30°C35°C40°C

1.8V

266 MHz

3.32

19.58

18.07

16.57

15.06

13.55

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