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SC3200 데이터시트(PDF) 442 Page - Advanced Micro Devices |
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SC3200 데이터시트(HTML) 442 Page - Advanced Micro Devices |
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442 / 447 page ![]() 442 AMD Geode™ SC3200 Processor Data Book Package Specifications Revision 5.1 Figure 10-3. 481-Terminal TEPBGA Package (Body Size: 40x40x2.38 mm; Pitch: 1.27 mm) NOTES: UNLESS OTHERWISE SPECIFIED. 1) TEPBGA WITH LEAD (PB): a) SOLDER BALL COMPOSITION: SN 63%, PB 37%. b) SOLDERING PROFILE: 220o C. 2) TEPBGA LEAD (PB) FREE: a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%. b) SOLDERING PROFILE: 260o C 3) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 4) THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION. 5) REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAU-1. 6) THETA JUNCTION TO CASE (TJC) = 5°C/WATT. |
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