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SC3200 데이터시트(PDF) 441 Page - Advanced Micro Devices

부품명 SC3200
상세설명  AMD GEODE-TM SC3200 PROCESSOR
PDF  447 Pages
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제조업체  AMD [Advanced Micro Devices]
홈페이지  http://www.amd.com
Logo AMD - Advanced Micro Devices

SC3200 데이터시트(HTML) 441 Page - Advanced Micro Devices

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AMD Geode™ SC3200 Processor Data Book
441
Package Specifications
Revision 5.1
10.2
Physical Dimensions
The figures in this section provide the mechanical package outlines for the 432-Terminal EBGA (Enhanced Ball Grid Array)
and 481-Terminal TEPBGA (Thermally Enhanced Ball Grid Array) packages.
Figure 10-2. 432-Terminal EBGA Package (Body Size: 40x40x1.72 mm; Pitch: 1.27 mm)
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
EBGA WITH LEAD (PB):
a) SOLDER BALL COMPOSITION: SN 63%, PB 37%.
b) SOLDERING PROFILE: 220o C.
2)
EBGA LEAD (PB) FREE:
a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%.
b) SOLDERING PROFILE: 260o C
3)
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
4)
REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.00, DATED JUNE 1997.
5)
THETA JUNCTION TO CASE (TJC) = 1°C/WATT.



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